The following two images show the top and the bottom side of the board after the solder masks (green) have been applied and after UV Leveling.


You can see the pretty much solid ground plane on the bottom layer .. it's made quite a difference. Tomorrow, I start showing you the assemble process of the board. I did not silk-screen the board (of course if I would ever sell a version of it I would do that) because I know where the components go and I wanted to keep the cost of board down.
No comments:
Post a Comment